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09691827423 HARTING Technologiegruppe2018+è¿æ¥å ̈D SUB MIXED FE 10A PL3 VERKAUFT. POWE
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UCC27423 TI09+8MSOP-PowerPAD, 8PDIP, 8SOICå ·æå ̄å ̈çåè· ̄ 4A MOSFET 驱å ̈å ̈
UCC27423DGN TI/BB0836+SOT-6 

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KP02A14-15S Amphenol Corporation24+è¿æ¥å ̈Rundsteckverbinder, Buchse, Größe 14, 15 Positionen, Gehäuse, Produktpalette:Pt-Serie,
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HSC1008R2J TE24+DIPHSC-Familie von Leistungswiderständen mit Aluminiumgehäuse 75 W bis 500 W, Verlustfähigkeit, Goldeloxierung und zwei Montageflanschen.
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UCC27423 TI09+8MSOP-PowerPAD, 8PDIP, 8SOICå ·æå ̄å ̈çåè· ̄ 4A MOSFET 驱å ̈å ̈
UCC27325 TI09+8MSOP-PowerPAD, 8PDIP, 8SOICå 4A å³°å1/4é«éä1/2ä3/4§μæº MOSFET 驱å ̈å ̈
UCC27324 TI09+8MSOP-PowerPAD, 8PDIP, 8SOICå 4A å³°å1/4é«éä1/2ä3/4§μæº MOSFET 驱å ̈å ̈
UCC27323 TI09+10+8MSOP-PowerPAD, 8PDIP, 8SOICå 4A å³°å1/4é«éä1/2ä3/4§μæº MOSFET 驱å ̈å ̈
UCC27322-Q1 TI10+8SOICå ·æä1/2¿è1/2ç« ̄çæ±1/2è1/2¦ç±»åè· ̄ 9A é«éä1/2ä3/4§ MOSFET 驱å ̈å ̈
UCC27322 TI10+8MSOP-PowerPAD, 8PDIP, 8SOICå ·æä1/2¿è1/2ç« ̄çåè· ̄ 9A é«éä1/2ä3/4§ MOSFET 驱å ̈å ̈
UCC27321-Q1 TI 8SOICå ·æä1/2¿è1/2ç« ̄çæ±1/2è1/2¦ç±»åè· ̄ 9A é«éä1/2ä3/4§ MOSFET 驱å ̈å ̈
UCC27321 TI10+8MSOP-PowerPAD, 8PDIP, 8SOICå ·æä1/2¿è1/2ç« ̄çå 9A é«éä1/2ä3/4§ MOSFET 驱å ̈å ̈
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UCC27200 TI09+10+8SO PowerPAD, 8SOIC, 8VSON120 - Vçå ̄å ̈ï1/43é«å³°ï1/4é«é¢çï1/4High-Side/Low-Side驱å ̈
UC3715 TI09+16SOIC, 8PDIP, 8SOICå ·æè3/4 å©è3/4åºçè3/4 å©å1/4å ³ FET 驱å ̈å ̈
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