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F3069F25V	Renesas	23+	QFP100	IC MCU 16BIT 512KB FLASH 100QFP
S3T-R-F5	DATENLOGIK	22+	DIP	Optoelektronische Sensoren
M393A8G40BB4-CWE	Samsung (Englisch)	21+	BGA (Englisch)	Samsung 64GB 2Rx4 PC4-3200 RDIMM DDR4-25600
TLP759(J,F)	Toshiba	21+	DIP	Optokoppler DC-IN 1-CH Transistor mit Basis DC-OUT 8-Pin PDIP
D-U204-ELK	Mors Smitt	24+	ç»§çμå ̈	ç¬æ¶ç»§çμå ̈
RC16M23D28	SOURIAU-SONNENBANK	2023+	è¿æ¥å ̈	Standard-Rundkontakte Crimp-Buchsenkontakt 16-20 AWG
CM300DY-24J	Mitsubishi	2021+	æ ̈¡å	Mitsubishi Electric 1200 V 300 IGBTæ ̈¡å, å, PCB, Néé
CM300DY-24Y	Mitsubishi	2021+	æ ̈¡å	Mitsubishi Electric 1200 V 300 IGBTæ ̈¡å, å, PCB, Néé
PT02E10-6S	Amphenol Industrial Operations	24+	è¿æ¥å ̈	CONN RCPT FMALE 6POS LÖTKELCH
KP02A14-15S	Amphenol Corporation	24+	è¿æ¥å ̈	Rundsteckverbinder, Buchse, Größe 14, 15 Positionen, Gehäuse, Produktpalette:Pt-Serie,
U-MULTILINK-FX	NXP (Englisch)	24+	å·¥å ·	NXP U-MULTILINKé£æå¡å°ç§å1/2å ̈USB-ML-Universal è°è ̄å ̈PEä»¿çå ̈
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HSC1008R2J	TE	24+	DIP	HSC-Familie von Leistungswiderständen mit Aluminiumgehäuse 75 W bis 500 W, Verlustfähigkeit, Goldeloxierung und zwei Montageflanschen.
Artikel-Nr.: 27914-30T12	ITT	2023+	è¿æ¥å ̈	Kontaktabmessungen - Stecker F80 Crimp
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LM4120IM5X-2.0	NSC	09+	SOT23-5	ç²3/4å ̄å3/4®åèä1/2åå·®ççμååºå
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