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OPA1641 TI10+8MSOP, 8SOICSound-Plus é«æ§è1/2ãJFET è3/4å ¥é³é¢è¿ç®æ3/4大å ̈
TPA6020A2 TI10+DSBGA-9ç«ä1/2声å ̈å·®å ̈ AB ç±»é³é¢æ3/4大å ̈
TPA2032D1 TI10+DSBGA-9å ·æ 2V/V åºå®å¢çç 2.75W å声é D ç±»é³é¢æ3/4大å ̈
OPA300 TI10+6SOT-23, 8SOICé«éä1/2åªå£°åçμæº CMOS è¿ç®æ3/4大å ̈
TPA2033D1 TI10+DSBGA-92.75W å声éå ̈å·®å ̈ 3V/V åºå®å¢çå è¿æ»¤ D ç±»é³é¢æ3/4大å ̈
TPA2034D1 TI10+DSBGA-92.75W å声éå ̈å·®å ̈ 4V/V åºå®å¢çå è¿æ»¤ D ç±»é³é¢æ3/4大å ̈
TPA2016D2 TI10+QFN-20å ·æ SmartGainTM AGC/DRC ç 2.8W/ééç«ä1/2声 D ç±»é³é¢æ3/4大å ̈
TPA2031D1 TI10+BGA (Englisch)å ·æä1/2éå ̄å ̈ç 2.5W å声é D ç±»é³é¢åçæ3/4大å ̈
TPA2035D1 TI10+9-DSBGAå ·æåºå®å¢çåçè· ̄èªå ̈æ¢å¤åè1/2ç 2.75W å声é D ç±»é³é¢æ3/4大å ̈
TPA2036D1 TI09+9-DSBGAå ·æå ̄åå¢çåçè· ̄èªå ̈æ¢å¤åè1/2ç 2.5W å声é D ç±»é³é¢æ3/4大å ̈

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C25-1AX-H13-N-HB-L HAIMOOO24+æ§å¶æææ§å¶ææ
F3069F25V Renesas23+QFP100IC MCU 16BIT 512KB FLASH 100QFP
S3T-R-F5 DATENLOGIK22+DIPOptoelektronische Sensoren
M393A8G40BB4-CWE Samsung (Englisch)21+BGA (Englisch)Samsung 64GB 2Rx4 PC4-3200 RDIMM DDR4-25600
TLP759(J,F) Toshiba21+DIPOptokoppler DC-IN 1-CH Transistor mit Basis DC-OUT 8-Pin PDIP
D-U204-ELK Mors Smitt24+继çμå ̈ç¬æ¶ç»§çμå ̈
RC16M23D28 SOURIAU-SONNENBANK2023+è¿æ¥å ̈Standard-Rundkontakte Crimp-Buchsenkontakt 16-20 AWG
CM300DY-24J Mitsubishi2021+æ ̈¡åMitsubishi Electric 1200 V 300 IGBTæ ̈¡å, å, PCB, Néé
CM300DY-24Y Mitsubishi2021+æ ̈¡åMitsubishi Electric 1200 V 300 IGBTæ ̈¡å, å, PCB, Néé
PT02E10-6S Amphenol Industrial Operations24+è¿æ¥å ̈CONN RCPT FMALE 6POS LÖTKELCH
KP02A14-15S Amphenol Corporation24+è¿æ¥å ̈Rundsteckverbinder, Buchse, Größe 14, 15 Positionen, Gehäuse, Produktpalette:Pt-Serie,
U-MULTILINK-FX NXP (Englisch)24+å·¥å ·NXP U-MULTILINKé£æå¡å°ç§å1/2å ̈USB-ML-Universal è°è ̄å ̈PE仿çå ̈
KPT02E8-4P ITT24+è¿æ¥å ̈Conn Circular PIN 4 POS Solder ST Box Mount 4 Terminal 1 Port
HSC1008R2J TE24+DIPHSC-Familie von Leistungswiderständen mit Aluminiumgehäuse 75 W bis 500 W, Verlustfähigkeit, Goldeloxierung und zwei Montageflanschen.
Artikel-Nr.: 27914-30T12 ITT2023+è¿æ¥å ̈Kontaktabmessungen - Stecker F80 Crimp
AF8/WA27F Daniels Manufacturing Corporation (DMC)24+å·¥å ·DMCåçº¿é³ åè£ è¿å£æ£å
CMF8342T CMF23+æ ̈¡åTç³»åä ̧æ管æ3/4大å ̈æ ̈¡å
RWR78N39R2FR Vishay24+DIPRES 39,2 OHM 10W 1% WW AXIAL
ETP41L18BXUU STPI22+继çμå ̈STPI/REL ETP6 Relais nicht selbsthaltend, 6 Blatt, 1 A, 72 VDC
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TPA2034D1 TI10+DSBGA-92.75W å声éå ̈å·®å ̈ 4V/V åºå®å¢çå è¿æ»¤ D ç±»é³é¢æ3/4大å ̈
TPA2016D2 TI10+QFN-20å ·æ SmartGainTM AGC/DRC ç 2.8W/ééç«ä1/2声 D ç±»é³é¢æ3/4大å ̈
TPA2031D1 TI10+BGA (Englisch)å ·æä1/2éå ̄å ̈ç 2.5W å声é D ç±»é³é¢åçæ3/4大å ̈
TPA2035D1 TI10+9-DSBGAå ·æåºå®å¢çåçè· ̄èªå ̈æ¢å¤åè1/2ç 2.75W å声é D ç±»é³é¢æ3/4大å ̈
TPA2036D1 TI09+9-DSBGAå ·æå ̄åå¢çåçè· ̄èªå ̈æ¢å¤åè1/2ç 2.5W å声é D ç±»é³é¢æ3/4大å ̈
TPA2005D1-Q1 TI10+8MSOPæ±1/2è1/2¦ç±» 1.4W å声éæ 滤波 D ç±»é³é¢åçæ3/4大å ̈
OPA322 TI10+5SOT-23, 6SOT-23å ·æå ³æç¶æç 20MHzãä1/2åªå£°ã1.8V RRIOãCMOS è¿ç®æ3/4大å ̈
OPA338 TI10+5SOT-23, 8SOICMicroAmplifier(TM) ç³»åå3/4®ååçμæº CMOS è¿ç®æ3/4大å ̈
TPA2017D2 TI09+QFN202.8-W/Chç«ä1/2声Dç±»é³é¢æ3/4大å ̈ï1/4å ·æç®åSmartGainTMèªå ̈å¢çæ§å¶
OPA341 TI10+6SOT-23, 8SOICåè· ̄ 5.5MHz RRIO ä1/2åèï1/4å ·æå ³æç¶æç OPA343ï1/4
OPA343 TI10+5SOT-23, 8SOICMicroAmplifier(TM) ç³»ååçμæºè1/2 ̈è³è1/2 ̈è¿ç®æ3/4大å ̈
OPA350 TI07+8MSOP, 8PDIP, 8SOICMicroAmplifier(TM) ç³»åé«éåçμæºè1/2 ̈è³è1/2 ̈è¿ç®æ3/4大å ̈
TPA2018D1 TI10+9DSBGAå ·æ SmartGain⢠AGC/DRC ç 3W å声é D ç±»é³é¢æ3/4大å ̈
OPA353 TI08+5SOT-23, 8SOICMicroAmplifier(TM) ç³»åé«éåçμæºè1/2 ̈è³è1/2 ̈è¿ç®æ3/4大å ̈
TPA2037D1 TI10+9DSBGAåºå®å¢ç 3.2W å声é D ç±»ï1/4å ·æéæ DAC åªå£°æ»¤æ³¢å ̈
TPA6012A4 TI10+HTSSOP24å ·æé«çº§ DC é³éæ§å¶ç 2W ç«ä1/2声é³é¢åçæ3/4大å ̈
OPA373 TI08+09+6SOT-23, 8SOIC6.5MHz 585uA è1/2 ̈è³è1/2 ̈ I/O CMOS è¿ç®æ3/4大å ̈
OPA374 TI10+5SOT-23, 8SOIC6.5MHzã585uAãè1/2 ̈è³è1/2 ̈ I/O CMOS è¿ç®æ3/4大å ̈
OPA377 TI10+5SC70, 5SOT-23, 8SOICä1/2ææ¬ãä1/2åªå£°ã5.5MHz CMOS è¿ç®æ3/4大å ̈
OPA380 TI10+8MSOP, 8SOICé«éç²3/4å ̄äºé»ææ3/4大å ̈

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